PSMA opens registration for 3D-PEIM 2026 in Tempe

Registration is open for the 6th International 3D Power Electronics Integration & Manufacturing Symposium, set for Nov. 16-19, 2026, at Arizona State University in Tempe. The event will spotlight 3D circuits, advanced packaging and manufacturing for power electronics, with sessions aimed at automotive, aerospace, data center and energy applications.

Why it matters: - 3D-PEIM 2026 is aimed at the technologies behind next-generation power electronics, including advanced packaging, vertical power delivery and 3D integration. - The symposium targets industries that depend on smaller, more efficient and more reliable power systems, including automotive, aerospace, data center and energy. - The event also gives researchers, manufacturers and industry leaders a forum to compare design, thermal, reliability and manufacturing approaches.

What happened: - PSMA announced that registration is open for the sixth International Symposium on 3D Power Electronics Integration and Manufacturing. - The symposium will take place Nov. 16-19, 2026, at Arizona State University in Tempe, Arizona. - Dr. Chris Bailey of ASU is the general chair. - Dr. Chanyeop Park of ASU and Matt Wilkowski of Würth Elektronik are the technical program co-chairs. - Organizers are encouraging attendees to register now.

The details: - The 2026 program includes six plenary presentations, seven technical sessions, expert-led tutorials, panel discussions, poster sessions and industry partner exhibits. - The agenda covers advanced packaging, 3D integrated modules, thermal management, design modeling and simulation, reliability and failure analysis, power delivery, energy storage and materials for advanced packaging. - The program is built around both fundamental research and practical implementation. - Plenary topics include AI power delivery, vertical power delivery for AI computing, heterogeneous integration for AI and high-performance computing, and 3D panel-level packaging. - Speakers include leaders from Intel, Applied Materials, Tyndall National Institute, Pennsylvania State University, Yuxuan Semi and NVIDIA. - The symposium will also include tours of Macro Technology Works facilities in Arizona State University Research Park. - Macro Technology Works is described as a university-operated semiconductor fabrication facility in the U.S. that works at industry-standard size and specifications. - Partner opportunities are available on the event website. - The announcement includes a LinkedIn page for PSMA updates.

Between the lines: - The speaker list shows a strong focus on AI infrastructure, especially the power demands of accelerators and data centers. - The mix of academic, corporate and government voices signals a conference designed to bridge research and commercial deployment. - The facility tour adds a hands-on element that may appeal to attendees focused on manufacturing readiness rather than only technical presentations.

What's next: - PSMA will move ahead with registration and conference planning ahead of the November event. - Attendees can expect additional engagement opportunities through exhibits, tutorials and partner participation. - The symposium website is the place to track partner options and event logistics.

The bottom line: - 3D-PEIM 2026 is positioning itself as a key industry gathering for the technologies powering denser, cooler and more manufacturable electronics.